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锡膏SMT术语(4)-中英文对照

【时间】2013-07-10 20:28:49   【来源】 indiums 【阅读】次 【字体:

      常用英语词汇与缩写:
  Accuracy:精度
  Additive Process:加成工艺
  Adhesion:附着力
  Aerosol:气溶剂
  Angle of attack:迎角
  Anisotropic adhesive:各异向性胶
  Annular ring:环状圈
  Application specific integrated circuit :ASIC特殊应用集成电路
  Array:列阵
  Artwork:布线图
  Automated test equipment:ATE自动测试设备
  Bond lift-off:锡膏SMT加工锡膏熔接升离
  Bonding agent:粘合剂
  CAD/CAM system:计算机辅助设计与制造系统
  Capillary action:毛细管作用
  Chip on board :COB板面芯片
  Circuit tester:电路测试机
  Cladding:覆盖层
  Cold cleaning:冷清洗
  Cold solder joint:冷焊锡点
  Conductive epoxy:导电性环氧树脂
  Conductive ink:导电墨水
  Conformal coating:共形涂层
  Copper foil:铜箔
  Copper mirror test:铜镜测试
  Cure:烘焙固化
  AOI(Automatic optical inspection):自动光学检查
  Assembly:组件
  ATE(Automated test equipment):自动测试设备
  Bare  Chip:裸芯片
  BGA( Ball grid array)球栅列阵
  Blind via:盲孔
  Blowholes:吹孔
  Bridge:锡桥
  Bridging:搭锡
  bulk feeder:散装式供料器
  Buried via:埋孔
  Chamber System:炉膛系统
  Chip:片状元件
  Circuit tester:电路测试机
  cleaning after soldering:焊后清洗
  Cold solder joint:冷焊锡点
  Component Check:元件检查
  Component density:元件密度
  Component Pick-Up:元件拾取
  Component Transport:元件传送
  Component:元件
  convection reflow soldering:热对流焊锡膏熔接温度
  Copper Clad Laminates:覆铜箔层压板
  Copper foil:铜箔
  Copper mirror test:铜镜测试
  CSP(Chip  Scale  Package):芯片规模的封装
  CTE(Coefficient of the thermal expansion):焊锡膏熔接膨胀系数
  Cure:烘焙固化
  Cursting:发生皮层
  Cycle rate:循环速率
  Data recorder:数据记录器
  Defect:缺陷
  Delamination:分层
  Desoldering:卸焊
  Dewetting:去湿
  DFM:为制造着想的设计
  Dispersant:分散剂
  Documentation:文件编制
  Downtime:停机时间
  Durometer:硬度计
  Desoldering:卸焊
  Device:器件
  Dewetting:缩锡
  DIP:双列直插
  Downtime:停机时间
  Dpm(defects per million):百万缺陷率
  dual wave soldering:双波峰焊
  Dull Joint:锡膏熔接再流焊灰暗
  Environmental test:环境测试
  Eutectic solders:共晶焊锡
  Excessive  Paste:膏量太多
  FCT(Functional test):功能测试
  feeder holder:供料器架
  feeders:供料器
  Fiducial:基准点
  Fillet:焊角
  Fine-pitch technology :FPT密脚距技术
  Fixture:夹具
  Flexibility:柔性
  flexible stencil:柔性金属漏版
  Flip chip:倒装芯片
  flux bubbles:焊剂气泡
  flying:飞片
  FPT(Fine-pitch technology):密脚距技术
  Full liquidus temperature:完全液化焊锡膏熔接
  Golden boy:金样
  Fundamentals of Solders and Soldering锡膏焊点及焊锡膏熔接基础知识
  Soldering Theory焊锡膏熔接理论
  Microstructure and Soldering显微结构及焊锡膏熔接
  Effect of Elemental Constituents on Wetting锡膏焊点成分对润湿的影响
  Effect of Impurities on Soldering杂质对焊锡膏熔接的影响
  Solder Paste Technology焊膏工艺
  Solder Powder  锡粉
  Solder Paste Rheology锡膏流变学
  Solder Paste Composition & Manufacturing锡膏成分和制造
  锡膏SMT Problems Occurred Prior to Reflow回流前锡膏SMT问题
  Flux Separation助焊剂分离
  Paste Hardening焊膏硬化
  Poor Stencil Life网板寿命问题
  Poor Print Thickness印刷厚度不理想
  Poor Paste Release From Squeegee锡膏脱离刮刀问题
  Smear印锡模糊
  Insufficiency锡不足
  Needle Clogging针孔堵塞
  Slump塌落
  Low Tack低粘性
  Short Tack Time 粘性时间短
  锡膏SMT Problems Occurred During Reflow回流过程中的锡膏SMT问题
  Cold Joints冷焊
  Nonwetting不润湿
  Dewetting反润湿
  Leaching浸析
  Intermetallics金属互化物
  Tombstoning立碑
  Skewing歪斜
  Wicking锡膏焊点上吸
  Bridging桥连
  Voiding空洞
  Opening开路
  Solder Balling锡球
  Solder Beading锡珠
  Spattering飞溅
  锡膏SMT Problems Occurred at Post Reflow Stage回流后问题
  White Residue白色残留物
  Charred Residue炭化残留物
  Poor Probing Contact探针测接问题
  Surface Insulation Resistance or Electrochemical Migration Failure表面绝缘阻抗或电化迁移缺陷
  Delamination/Voiding/Non-curing Of Conformal Coating/Encapsulants分层/空洞/敷形涂覆或包封的固化问题
  Challenges at BGA and CSP Assembly and Rework Stage  BGA、CSP组装和翻修的挑战
  Starved Solder Joint少锡锡膏熔接再流焊
  Poor Self-Alignment自对位问题
  Poor Wetting润湿不良
  Voiding空洞
  Bridging桥连
  Uneven Joint Height锡膏熔接再流焊高度不均
  Open开路
  Popcorn and Delamination爆米花和分层
  Solder Webbing锡网
  Solder Balling锡球
  Problems Occurred at Flip Chip Reflow Attachment倒装晶片回流期间发生的问题
  Misalignment位置不准
  Poor Wetting润湿不良
  Solder Voiding空洞
  Underfill Voiding底部填充空洞
  Bridging桥连
  Open开路
  Underfill Crack底部填充裂缝
  Delamination分层)
  Filler Segregation填充分离
  Insufficient Underfilling底部填充不充分
  Optimizing Reflow Profile via Defect Mechanisms Analysis回流曲线优化与缺陷机理分析
  Flux Reaction助焊剂反应
  Peak Temperature峰值焊锡膏熔接
  Cooling Stage冷却阶段
  Heating Stage加热阶段
  Timing Considerations时间研究
  Optimization of Profile曲线优化
  Comparison with Conventional Profiles与传统曲线的比较
  Discussion讨论
  Implementing Linear Ramp Up Profile斜坡式曲线
  general placement equipment:中速贴装机
  Golden boy:金样
  Halides:卤化物
  Hard water:硬水
  Hardener:硬化剂
  high speed placement equipment:高速贴装机
  hot air reflow soldering:热风焊锡膏熔接温度
  ICT(In-circuit test):在线测试
  In-circuit test:在线测试
  Insufficient Paste:膏量不足
  JIT(Just-in-time):刚好准时
  laser reflow soldering:激光焊锡膏熔接温度
  LCCC(Leadless  Ceramic  Chip  Carrier):无引脚陶瓷芯片载体
  Lead configuration:引脚外形
  Line certification:生产线确认
  located soldering:局部软钎焊
  low speed placement equipment:低速贴装机
  low temperature paste:低温焊膏
  Machine vision:机器视觉
  Mean time between failure :MTBF平均故障间隔时间
  Manhattan effect:曼哈顿现象
  melf:圆柱形元件
  metal stencil:金属漏版
  Misalignment:偏斜
  Modularity:模块化
  Movement:移位
  no-clean solder paste:免清洗焊膏
  Non-Dewetting:不沾锡
  Nonwetting:不熔湿的
  optic correction system :光学校准系统
  Organic activated :OA有机活性的
  Packaging density:装配密度
  Photoploter:相片绘图仪
  Placement equipment:贴装设备
  past mask:焊膏膜(漏板)
  paste shelf life:焊膏贮存寿命
  PCB(Printed circuit board):印刷电路板
  Pick-and-place:拾取-贴装设备
  placement accuracy:贴装精度
  placement direction:贴装方位
  Placement equipment:贴装设备
  placement pressure:贴装压力
  Placement Procedure:元件放置
  placement speed:贴装速度
  PLCC(Plastic  Leaded  Chip  Carrier):塑型有引脚芯片载体
  Poor Tack Retention:粘着力不足
  precise placement equipment:精密贴装机
  PTH (Pin  Through  the   Hole):通孔安装
  QFP(Quad  Flat  Package):多引脚方形扁平封装
  Reflow soldering:回流焊锡膏熔接
  Repair:修理
  Repeatability:可重复性
  Rheology:流变学
  repeatability:重复性
  resolution:分辨率
  Rework:返工
  rotating deviation:旋转偏差
  Schematic:原理图
  Semi-aqueous cleaning:不完全水清洗
  Shadowing:阴影
  Silver chromate test:铬酸银测试
  Slump:坍落
  Solder bump:焊锡球
  Solderability:可焊性
  Soldermask:阻焊
  Solids:固体
  Solidus:固相线
  Statistical process control :SPC统计过程控制
  Storage life:储存寿命
  Subtractive process:负过程
  Surfactant:表面活性剂
  Syringe:注射器
  screen printer:丝网印刷机
  screen printing plate:网版
  screen printing:丝网印刷
  self alignment:自定位
  sequential placement:顺序贴装
  shifting deviation:平移偏差
  silk screen:丝印面
  SIP:单列直插
  skewing:偏移
  slump:塌落
  Slumping:坍塌
  SMA  (Surface  Mount  Assembly):表面安装组件
  SMB  (Surface  Mount  Printed  Circuit  Board):表面安装PCB板
  SMC  (Surface  Mount  Component):表面安装元件
  SMD  (Surface  Mount  Device):表面安装器件
  Smearing:模糊
  锡膏SMT(Surface   Mounted   Technology):表面安装技术
  SOIC(Small  outline  IC):小外形集成电路,
  Solder bump:焊锡球
  solder mask:焊锡膏熔接掩摸(阻焊膜)
  solder mask:阻焊漆
  Solderability:可焊性
  Soldermask:阻焊
  Solding  Pasts:焊锡膏
  SOP(Small  outline  Package):小外型封装
  SOT(Small  Outline  Transistor):小外形晶体管
  squeegee:刮板
  stencil printing:漏版印刷
  Stencils:模板、漏板、钢板
  stick feeder:杆式供料器
  tape feeder:带式供料器
  Tape-and-reel:带和盘
  Tape-and-reel:带和盘
  Thermocouple:热电偶
  Tombstoning:元件立起
  through via:通孔
  THT(Through  Hole  Technology):通孔安装技术
  tomb stone effect:墓碑现象
  Tombstoning:元件立起
  tray feeder:盘式供料器
  Ultra-fine-pitch:超密脚距
  Vapor degreaser:汽相去油器
  paste working 1ife:焊膏工作寿命
  vapor phase soldering(VPS): 气相焊锡膏熔接温度
  via:导孔
  Voids:空洞
  Yield:产出率

(编辑:锡膏SMT贴片加工



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